IC Packaging Engineer

소개

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for perfection to work towards an extraordinary result? We are looking for a talented and passionate IC Packaging Engineer. You will be responsible for IC packaging development and new product introduction for programs requiring SIP module packaging and substrate-based IC packaging.

주요업무

• Work with cross-functional teams and lead package integration and architecture efforts. • Work with 3rd party and OSATs to bring IC packaging solutions from concept to mass production. • Work to bring innovative packaging solutions from concept to mass production, including package, module and technology development. • Conduct and approve packaging proposals, designs, schematics, process flows, risk assessments, technical specifications, reliability requirements, data collection, and analysis.

자격요건

• Bachelor's degree and 10+ years of relevant industry experience in Semiconductor Packaging Design, Process and New Product Introduction. • Must have hands-on experience and expertise on IC packaging.

우대사항

• At least 5+ years of experience in Semiconductor Packaging Design, Process and New Product Introduction. • Strong knowledge and experience in IC packaging, SIP Module packaging, single die packaging and heterogeneous package integration. • Knowledge and experience in package assembly process, materials, and equipment. • Experience driving development of new enabling technology and roadmaps. • Strong IC packaging materials background including characterization and failure analysis. • Problem solver with strong engineering physics; willing to tackle tough problems. • Ability to work independently and with multi-functional teams. • Proven track record working with internal teams or vendors to execute introduction of new packaging and technology solutions.

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